Semiconductor Industry Solutions

Ultra-Clean Piping for Chip Manufacturing

Equipment Recommendation
Process Guidance
Training & Support

Industry Overview

Semiconductor manufacturing demands the ultimate in cleanliness for gas delivery and chemical distribution systems. Contamination at the molecular level can cause yield losses worth millions. Kedes machines deliver the ultra-clean weld preparation needed for semiconductor fab gas systems and high-purity chemical piping.

Semiconductor Industry Standards

Our equipment supports semiconductor fabrication requirements:

  • SEMI Standards – Equipment and Materials Specifications
  • SEMI F81 – Gas and Chemical Delivery Systems
  • ASME BPE – Bioprocessing Equipment (adapted for semiconductor)
  • ISO 14644 – Cleanroom Standards
  • ITRS – Technology Roadmap Requirements

Surface Quality Requirements

Semiconductor gas systems demand exceptional surface quality:

ParameterUHP RequirementOur Capability
Surface Finish<10 RaAchievable
ParticlesNone visible 10XParticle-free
Moisture<1 ppb systemClean dry
Oxygen<1 ppb systemNo oxidation

High-Purity Materials

Semiconductor applications use specialized materials:

  • 316L VIM-VAR – Vacuum induction/arc remelted stainless
  • Hastelloy C-22 – Corrosive chemical resistance
  • PFA/PTFE – Fluoropolymer-lined systems
  • Electropolished – Pre-finished tube and fittings

Our equipment handles these materials without compromising their high-purity properties.

Cleanroom Considerations

For cleanroom-adjacent work:

  • HEPA-filtered machine enclosures available
  • Non-shedding surface finishes
  • Cleanable external surfaces
  • Minimal particle generation during operation

Honest Talk About Semiconductor Applications

What We Can and Cannot Promise

Let’s be clear about the reality of ultra-high purity work:

We prepare tube ends for welding. We do this cleanly and consistently. But tube prep is one step in a system that involves handling, assembly, welding, cleaning, and passivation. If contamination enters anywhere in that chain, the result is still a contaminated system.

Our machines don’t make a “10 Ra surface” directly on every cut. We produce clean, consistent cuts that, when combined with proper welding technique and post-weld electropolish, result in systems meeting UHP specifications. If you need sub-10 Ra on the cut surface itself before any post-processing, you may need additional polishing steps.

The Semiconductor Purity Chain

Every semiconductor gas line contractor knows this, but it’s worth stating: tube prep is one link in a long chain.

What we control: Clean, dimensionally accurate, particle-free tube ends ready for orbital welding.

What we don’t control: Everything else—handling, fitting installation, welding, purge maintenance, system cleaning, passivation, qualification testing.

If you have purity failures, don’t automatically blame the prep equipment. Look at the whole process.

When Pre-Cut Tube Makes Sense

For many semiconductor projects, the tube supplier can provide:

  • Cut to length
  • Ends faced and deburred
  • Pre-cleaned and bagged
  • Certification included

Our honest advice: If your supplier offers this, and the cost is reasonable, consider using it for small-diameter UHP tubing. Our equipment makes more sense when you:

  • Need on-site flexibility to cut to length
  • Have volume that justifies in-house capability
  • Work with larger sizes the supplier doesn’t prep

The Exhaust System Reality

Not everything in a fab is ultra-high purity. Exhaust, abatement, and waste systems are often 316L but not UHP spec.

Don’t over-spec exhaust prep. Yes, it’s stainless, and yes, welds should be clean. But you don’t need the same prep you’d use for silane delivery. Match the equipment and procedures to the actual requirements.

Our Recommendations for Semiconductor Work

  1. For UHP gas lines: Our LPM Tube Facing machines provide the consistent squareness orbital welders need. Focus on faced ends, not just cut ends.

  2. For bulk chemical and exhaust: Standard stainless prep with our ID-mount machines works well. These systems need good welds, not necessarily UHP-level prep.

  3. For small-diameter UHP (<1”): Honestly, evaluate pre-cut and prepped tube from your supplier. It may be more economical than in-house prep for small tube.

Industry Challenges

01

Particle-Free Requirements

Semiconductor processes require surfaces with virtually no particles. Any contamination from fabrication can cause device failures.

02

Ultra-High Purity Materials

Electropolished 316L UHP stainless steel and specialty alloys require careful handling to maintain surface quality.

03

Tight Tolerances

Orbital welding for UHP systems demands precise dimensional control for consistent automatic weld results.

04

Cleanroom Compatibility

Some pipe preparation must occur in or near cleanroom environments, requiring equipment that doesn't generate contamination.

Our Solutions

Particle-Free Cutting

Our cutting technology produces surfaces free of particles and contamination, ready for cleanroom assembly.

Electropolished Surface Preservation

Careful machine design prevents damage to pre-electropolished tube surfaces during the cutting process.

Orbital Weld Optimization

Precise geometry control ensures reliable automatic welding with minimum heat input and consistent penetration.

Clean Environment Operation

Machines can be configured for operation in controlled environments with appropriate enclosures and filtration.

Common Questions

What's the typical turnaround for pipe prep in semiconductor field conditions?

Honestly, it depends on the pipe size and site constraints. For most field jobs we see, a trained operator can prep a 12" pipe in about 15-20 minutes including setup. Tighter spaces add time. The key is having the right mounting method for your situation—ID mount works great when you have access, but OD clamp systems save time when you don't.

Do we really need cold cutting for this application, or is flame cutting acceptable?

This comes up a lot. For carbon steel in non-critical applications, flame cutting can work—but you'll need additional grinding to remove the heat-affected zone before welding. Cold cutting eliminates that step entirely. For stainless, duplex, or anything going into ASME code work, cold cutting isn't optional. The metallurgical benefits pay for themselves in reduced rework.

Our crew has never used portable beveling machines. How steep is the learning curve?

Most operators we train get comfortable within a day of hands-on practice. The machines aren't complicated—it's more about understanding proper clamping pressure and feed rates for your specific pipe material. We include training videos and can arrange remote support for your first few jobs if needed. The bigger adjustment is usually convincing old-timers to give up their grinders.

What should we look for when the machine isn't cutting cleanly?

Nine times out of ten, it's either a dull insert or incorrect clamping. Check that the machine is seated square to the pipe face and the clamping force is even. For chatter marks, reduce your feed rate. For rough finishes on stainless, make sure you're using the right insert grade—carbide designed for carbon steel will tear stainless. When in doubt, a fresh insert usually solves most issues.

Ready to Discuss Your Semiconductor Project?

Our engineers specialize in pipe preparation solutions for the semiconductor industry. Contact us for equipment recommendations tailored to your specific requirements.

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